SMART-FTI | Surface Module Approach for Rapid Testing in Flight Test Instrumentation

Summary
For the aerodynamic characterization of the RACER IADP, an aerodynamic flight test instrumentation that fulfills the special requirements is demanded. In this project, an innovative flight test instrumentation approach will be realized with the development of a fully integrated instrumentation module technology.
The instrumentation modules will be thin, lightweight, and of high-strength and temperature resistance in a surface-conformal and aerodynamic shape and will be fabricated from compound materials and metals by additive manufacturing. Different sensors and probes, such as pressure ports, Kiel probes or multi-hole probes, will be integrated into these modules for aerodynamic characterization. For data acquisition, miniaturized distributed acquisition nodes (DAN) (pressure and temperature scanners, equipped with an Ethernet interface) will be distributed. These elements and all additional internal channels, wiring, and connectors will be integrated into the modules without disturbing the aerodynamic design.
These modules can be calibrated offsite and installed nonintrusively by reversible bonding on a protection layer and positive locking with low effort. After mounting, only power and data connection will need to be established, presenting a ‘plug&play’ installation scheme. The module approach in combination with an ethernet interface ensures sustainability and compatibility with other flight test instrumentation (FTI) systems. This is crucial to ensure synchronization with the existing flight test instrumentation of the topic manager.
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Web resources: https://cordis.europa.eu/project/id/886057
Start date: 01-06-2020
End date: 31-05-2023
Total budget - Public funding: 1 714 255,00 Euro - 1 199 978,00 Euro
Cordis data

Original description

For the aerodynamic characterization of the RACER IADP, an aerodynamic flight test instrumentation that fulfills the special requirements is demanded. In this project, an innovative flight test instrumentation approach will be realized with the development of a fully integrated instrumentation module technology.
The instrumentation modules will be thin, lightweight, and of high-strength and temperature resistance in a surface-conformal and aerodynamic shape and will be fabricated from compound materials and metals by additive manufacturing. Different sensors and probes, such as pressure ports, Kiel probes or multi-hole probes, will be integrated into these modules for aerodynamic characterization. For data acquisition, miniaturized distributed acquisition nodes (DAN) (pressure and temperature scanners, equipped with an Ethernet interface) will be distributed. These elements and all additional internal channels, wiring, and connectors will be integrated into the modules without disturbing the aerodynamic design.
These modules can be calibrated offsite and installed nonintrusively by reversible bonding on a protection layer and positive locking with low effort. After mounting, only power and data connection will need to be established, presenting a ‘plug&play’ installation scheme. The module approach in combination with an ethernet interface ensures sustainability and compatibility with other flight test instrumentation (FTI) systems. This is crucial to ensure synchronization with the existing flight test instrumentation of the topic manager.

Status

CLOSED

Call topic

JTI-CS2-2019-CFP10-AIR-02-80

Update Date

27-10-2022
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