Cochisa | European Core-Chip for Space Applications

Summary
COCHISA aims to foster the European non-dependence in terms of critical RF components for space applications. For this, scalable multi-channel radiation-hard beamforming core-chips operating in X-band (10 GHz) as well as Ka-band (28 GHz) will be developed. The scalable approach will allow to increase the number of beamforming channels as well as to scale the system to higher operational frequencies. COCHISA does not only focus on the IC itself, but also a cost-effective plastic non-hermetic MMIC packaging process supporting space applications by robust encapsulation.
Furthermore, a fully European supply chain for the core-chips will be established, based on the European foundry and packaging partners. This includes the availability of a proven radiation-hard SiGe BiCMOS technology with qualified radiation-hard libraries. Due to the establishment of the European supply chain, the mid-term impact will be the wider use of the European radiation-hard technology, increasing the number of ITAR-free European space-grade components.
A main objective of COCHISA is to reach at least TRL 7 for the developed and packaged X-band core-chip, proven by the scheduled radiation and reliability tests. During the COCHISA project, a dedicated work package will prepare the commercial exploitation and market introduction of the project results, especially to make the developed core-chips available to the European and global space industry.
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More information & hyperlinks
Web resources: https://cordis.europa.eu/project/id/101081749
Start date: 01-11-2022
End date: 31-10-2025
Total budget - Public funding: 2 942 872,50 Euro - 2 942 872,00 Euro
Cordis data

Original description

COCHISA aims to foster the European non-dependence in terms of critical RF components for space applications. For this, scalable multi-channel radiation-hard beamforming core-chips operating in X-band (10 GHz) as well as Ka-band (28 GHz) will be developed. The scalable approach will allow to increase the number of beamforming channels as well as to scale the system to higher operational frequencies. COCHISA does not only focus on the IC itself, but also a cost-effective plastic non-hermetic MMIC packaging process supporting space applications by robust encapsulation.
Furthermore, a fully European supply chain for the core-chips will be established, based on the European foundry and packaging partners. This includes the availability of a proven radiation-hard SiGe BiCMOS technology with qualified radiation-hard libraries. Due to the establishment of the European supply chain, the mid-term impact will be the wider use of the European radiation-hard technology, increasing the number of ITAR-free European space-grade components.
A main objective of COCHISA is to reach at least TRL 7 for the developed and packaged core-chips (X-band and Ka-band). This TRL level will be proven by the scheduled radiation and reliability tests. During the COCHISA project, a dedicated work package will prepare the commercial exploitation and market introduction of the project results, especially to make the developed core-chips available to the European and global space industry.

Status

SIGNED

Call topic

HORIZON-CL4-2021-SPACE-01-81

Update Date

18-01-2023
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Horizon Europe
HORIZON.2 Global Challenges and European Industrial Competitiveness
HORIZON.2.4 Digital, Industry and Space
HORIZON.2.4.10 Space, including Earth Observation
HORIZON-CL4-2021-SPACE-01
HORIZON-CL4-2021-SPACE-01-81 Space technologies for European non-dependence and competitiveness