Summary
SiPearl was spun off from the European Processor Initiative (EPI) with €7.4m of initial funding to develop high-end microprocessors and protect European chip sovereignty. In the past 2 years, SiPearl has partnered and contracted with Arm and other top-tier IP providers, secured a €4.6M order book and identified a €1.1Bn sales pipeline in Europe alone. SiPearl is currently raising an €80M+ Series A. We are confident to close this round by year-end based on the achievements of the past 3 months: lead term sheet from a lead corporate investor of our industry, 25M€ venture loan from the EIB, €15M follow-on grant from EPI and additional LOIs from several corporate and public investors. We are currently hiring 7-10 employees per month in Europe. This funding application relates to an additional €2.5M EIC grant + €15M EIC equity which is meant to support the development of our next generation HELIOS platform architecture that supports the new European Chips Act by reducing the cost and time of new chip designs.”
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More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/190183836 |
| Start date: | 01-07-2022 |
| End date: | 30-06-2025 |
| Total budget - Public funding: | 25 650 001,25 Euro - 2 500 000,00 Euro |
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Original description
SiPearl was spun off from the European Processor Initiative (EPI) with €7.4m of initial funding to develop high-end microprocessors and protect European chip sovereignty. In the past 2 years, SiPearl has partnered and contracted with Arm and other top-tier IP providers, secured a €4.6M order book and identified a €1.1Bn sales pipeline in Europe alone. SiPearl is currently raising an €80M+ Series A. We are confident to close this round by year-end based on the achievements of the past 3 months: lead term sheet from a lead corporate investor of our industry, 25M€ venture loan from the EIB, €15M follow-on grant from EPI and additional LOIs from several corporate and public investors. We are currently hiring 7-10 employees per month in Europe. This funding application relates to an additional €2.5M EIC grant + €15M EIC equity which is meant to support the development of our next generation HELIOS platform architecture that supports the new European Chips Act by reducing the cost and time of new chip designs.”Status
SIGNEDCall topic
HORIZON-EIC-2021-ACCELERATOROPEN-01Update Date
09-02-2023
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