Summary
Lasers are a ubiquitous technology in optical communication, sensors, LiDAR or emerging quantum science and technology. Yet, the principles by which lasers are manufactured have remarkably not changed since the invention of the laser: they are assembled by hand, using bulk components or optical fibers. While integrated lasers based on silicon photonics exist, they do not challenge such high performance legacy lasers systems. FORTE will change this notion. Building on a recent breakthrough in the field of low loss integrated photonics it is today possible to create lasers that are low cost, wafer scale manufacturable that have better performance that the fiber laser – the workhorse of fiber sensing and gold standard in coherence. The overarching ambition of this EIC transition project is to develop a prototype and mature photonic integrated circuit-based frequency-agile ultra-low noise laser technology, and apply it to the domain of fiber sensing and FMCW LiDAR, and to develop a scalable manufacturing. The unique selling points (USP) of the platform are that it is based on photonic integrated circuit technology that is scalable, flexible, reconfigurable, and extremely high performance in terms of optical coherence and frequency-agility. The technology is based on a patented approach that combines ultra-low loss photonic integrated circuits based on silicon nitride, with MEMS technology, as used in wireless technology. The approach addresses the need for low-noise laser sources in multiple domains of photonic sensing including distributed fiber optic sensing (DFOS) and coherent laser ranging (FMCW LiDAR). The consortium includes companies in fiber sensing, LiDAR as well as in the development of industrial manufacturing tools. The results will be commercialized by the involvement of SME in fiber sensing, and a dedicated startup to bring hybrid integrated frequency agile low noise lasers to the market.
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| Web resources: | https://cordis.europa.eu/project/id/101137084 |
| Start date: | 01-10-2023 |
| End date: | 31-03-2026 |
| Total budget - Public funding: | 1 966 218,75 Euro - 1 966 218,00 Euro |
Cordis data
Original description
Lasers are a ubiquitous technology in optical communication, sensors, LiDAR or emerging quantum science and technology. Yet, the principles by which lasers are manufactured have remarkably not changed since the invention of the laser: they are assembled by hand, using bulk components or optical fibers. While integrated lasers based on silicon photonics exist, they do not challenge such high performance legacy lasers systems. FORTE will change this notion. Building on a recent breakthrough in the field of low loss integrated photonics it is today possible to create lasers that are low cost, wafer scale manufacturable that have better performance that the fiber laser – the workhorse of fiber sensing and gold standard in coherence. The overarching ambition of this EIC transition project is to develop a prototype and mature photonic integrated circuit-based frequency-agile ultra-low noise laser technology, and apply it to the domain of fiber sensing and FMCW LiDAR, and to develop a scalable manufacturing. The unique selling points (USP) of the platform are that it is based on photonic integrated circuit technology that is scalable, flexible, reconfigurable, and extremely high performance in terms of optical coherence and frequency-agility. The technology is based on a patented approach that combines ultra-low loss photonic integrated circuits based on silicon nitride, with MEMS technology, as used in wireless technology. The approach addresses the need for low-noise laser sources in multiple domains of photonic sensing including distributed fiber optic sensing (DFOS) and coherent laser ranging (FMCW LiDAR). The consortium includes companies in fiber sensing, LiDAR as well as in the development of industrial manufacturing tools. The results will be commercialized by the involvement of SME in fiber sensing, and a dedicated startup to bring hybrid integrated frequency agile low noise lasers to the market.Status
SIGNEDCall topic
HORIZON-EIC-2023-TRANSITIONOPEN-01Update Date
12-03-2024
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