Helios-Plugin | Secure software implementation of an eSIM

Summary
The eSIM is a form of integrated SIM soldered directly onto the circuit board of a connected or mobile device, and thus CANNOT and NEEDNOT be removed from the device. The eSIM has great potential in network authentication because of the immense benefits it offers to users. Its potential can be enhanced by synthezing its inherent features with further technological developments to ensure multi-application operability and migration from hardware. Current eSIMs are hardware dependant and can only be implemented as a soldered Secure Element (SE) in the device. As a result, they cannot be deployed on existing devices, making old devices obsolete. Additionally, each SE is currently linked to one application, meaning that a single user will need multiple eSE on different devices which is costly and inconvenient. An unmet opportunity has thus been identified for developing a multi-application software based eSIM that will enable maximum exploitation of the eSIM technology.
OSSE has identified this opportunity and has developed the Helios-Plugin, a GSMA compliant secure SOFTWARE implementation of an eSIM. The Plug-in will be combined in usage with a multipurpose, SE but can however be deployed on an SE mounted on an existing device. Helios-Plugin enables the use of the SE for multiple purposes e.g. payment or transport applications which reduces TCO of eSIM from €1 to below €0.85/unit for OEMs and also reduces cost of SIM replacement by 94% (€5 to €0.3). The eSIM plug-in software can dynamically be downloaded and updated, enabling the user to benefit from bug fixing and feature updates.
Helios-Plugin is at an advanced stage of development having been demonstrated with NXP. During Ph1, we will develop a road map to finalise Helios-Plugin and Ph2 will see us developing and validating the market version.
Our turnover will come from royalties for each device deployed with Helios-Plugin. We target to achieve a cumulative turnover of €12.5M by the 5th year of commercialisation.
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More information & hyperlinks
Web resources: https://cordis.europa.eu/project/id/836206
Start date: 01-01-2019
End date: 30-04-2019
Total budget - Public funding: 71 429,00 Euro - 50 000,00 Euro
Cordis data

Original description

The eSIM is a form of integrated SIM soldered directly onto the circuit board of a connected or mobile device, and thus CANNOT and NEEDNOT be removed from the device. The eSIM has great potential in network authentication because of the immense benefits it offers to users. Its potential can be enhanced by synthezing its inherent features with further technological developments to ensure multi-application operability and migration from hardware. Current eSIMs are hardware dependant and can only be implemented as a soldered Secure Element (SE) in the device. As a result, they cannot be deployed on existing devices, making old devices obsolete. Additionally, each SE is currently linked to one application, meaning that a single user will need multiple eSE on different devices which is costly and inconvenient. An unmet opportunity has thus been identified for developing a multi-application software based eSIM that will enable maximum exploitation of the eSIM technology.
OSSE has identified this opportunity and has developed the Helios-Plugin, a GSMA compliant secure SOFTWARE implementation of an eSIM. The Plug-in will be combined in usage with a multipurpose, SE but can however be deployed on an SE mounted on an existing device. Helios-Plugin enables the use of the SE for multiple purposes e.g. payment or transport applications which reduces TCO of eSIM from €1 to below €0.85/unit for OEMs and also reduces cost of SIM replacement by 94% (€5 to €0.3). The eSIM plug-in software can dynamically be downloaded and updated, enabling the user to benefit from bug fixing and feature updates.
Helios-Plugin is at an advanced stage of development having been demonstrated with NXP. During Ph1, we will develop a road map to finalise Helios-Plugin and Ph2 will see us developing and validating the market version.
Our turnover will come from royalties for each device deployed with Helios-Plugin. We target to achieve a cumulative turnover of €12.5M by the 5th year of commercialisation.

Status

CLOSED

Call topic

EIC-SMEInst-2018-2020

Update Date

27-10-2022
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Horizon 2020
H2020-EU.2. INDUSTRIAL LEADERSHIP
H2020-EU.2.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
H2020-EU.2.1.0. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-1
H2020-EU.2.3. INDUSTRIAL LEADERSHIP - Innovation In SMEs
H2020-EU.2.3.0. INDUSTRIAL LEADERSHIP - Innovation In SMEs - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-1
H2020-EU.3. SOCIETAL CHALLENGES
H2020-EU.3.0. Cross-cutting call topics
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-1