INSTET | Securing the Internet of Things with a unique microchip fingerprinting technology

Summary
Intrinsic ID is a Dutch SME, a spin-off from Philips Research, a world leader in security solutions for chips, with 25+ patents. Intrinsic ID has created a technology to uniquely identify & authenticate chips based on the inherent characteristics of their memory component (SRAM). This technology called Physical Unclonable Function (PUF) is a digital equivalent of a fingerprint.
Intrinsic ID is working on INSTET—a fully-fledged security solution on top of PUF that will protect low-end chips that are omnipresent in IoT devices everywhere by making them physically & cryptographically secure and very resilient to advanced attacks. INSTET will work as a Root of Trust—a set of core software components that are always trusted by the chip, and provide a trust foundation for the IoT device & distributed IoT systems.
INSTET addresses the core problem of semiconductor vendors and OEMs—lack of security. INSTET can be deployed on almost any chip, including the ones that are already in the field, without costly redesigns or additional hardware, generating savings of up to 90% per chip.
Intrinsic ID has successfully completed an SME Instrument Phase 1 feasibility study & validated business opportunities in wearables, medical electronics & critical infrastructure verticals.
In this 2-year Phase 2 project Intrinsic ID will complete industrialization of INSTET, validate it in 3 trial cases & start commercialization. The total requested EC contribution is €1,75m. Intrinsic ID is the sole benefactor & the party responsible for implementation of this Phase 2 project.
Unfold all
/
Fold all
More information & hyperlinks
Web resources: https://cordis.europa.eu/project/id/811509
Start date: 01-06-2018
End date: 31-05-2020
Total budget - Public funding: 2 496 362,50 Euro - 1 747 453,00 Euro
Cordis data

Original description

Intrinsic ID is a Dutch SME, a spin-off from Philips Research, a world leader in security solutions for chips, with 25+ patents. Intrinsic ID has created a technology to uniquely identify & authenticate chips based on the inherent characteristics of their memory component (SRAM). This technology called Physical Unclonable Function (PUF) is a digital equivalent of a fingerprint.
Intrinsic ID is working on INSTET—a fully-fledged security solution on top of PUF that will protect low-end chips that are omnipresent in IoT devices everywhere by making them physically & cryptographically secure and very resilient to advanced attacks. INSTET will work as a Root of Trust—a set of core software components that are always trusted by the chip, and provide a trust foundation for the IoT device & distributed IoT systems.
INSTET addresses the core problem of semiconductor vendors and OEMs—lack of security. INSTET can be deployed on almost any chip, including the ones that are already in the field, without costly redesigns or additional hardware, generating savings of up to 90% per chip.
Intrinsic ID has successfully completed an SME Instrument Phase 1 feasibility study & validated business opportunities in wearables, medical electronics & critical infrastructure verticals.
In this 2-year Phase 2 project Intrinsic ID will complete industrialization of INSTET, validate it in 3 trial cases & start commercialization. The total requested EC contribution is €1,75m. Intrinsic ID is the sole benefactor & the party responsible for implementation of this Phase 2 project.

Status

CLOSED

Call topic

EIC-SMEInst-2018-2020

Update Date

27-10-2022
Images
No images available.
Geographical location(s)
Structured mapping
Unfold all
/
Fold all
Horizon 2020
H2020-EU.2. INDUSTRIAL LEADERSHIP
H2020-EU.2.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
H2020-EU.2.1.0. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2
H2020-EU.2.3. INDUSTRIAL LEADERSHIP - Innovation In SMEs
H2020-EU.2.3.0. INDUSTRIAL LEADERSHIP - Innovation In SMEs - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2
H2020-EU.3. SOCIETAL CHALLENGES
H2020-EU.3.0. Cross-cutting call topics
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2