Summary
New strategic and growing markets related to connectivity, mobility, automotive, health and earth monitoring call for improved imaging solutions in visible, LWIR and VLWIR offering advanced functionalities and cost effectiveness. Visible imagers market is currently largely dominated by non-European countries. LWIR µbolometers imagers, fabricated above-IC, have not yet been democratized for high volume markets due to the difficulty to solve performance versus cost equation. However, Asian providers are making important progress to tackle this challenge.
ATHENA aims at strengthening European economy in high-tech imaging technologies:
- by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities
- by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions
- by using new methods of growing and doping materials for future VLWIR imager manufacturability.
This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring.
ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption.
In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.
ATHENA aims at strengthening European economy in high-tech imaging technologies:
- by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities
- by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions
- by using new methods of growing and doping materials for future VLWIR imager manufacturability.
This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring.
ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption.
In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.
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More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/101139941 |
| Start date: | 01-09-2024 |
| End date: | 31-08-2027 |
| Total budget - Public funding: | 39 499 960,88 Euro - 12 008 241,00 Euro |
Cordis data
Original description
New strategic and growing markets related to connectivity, mobility, automotive, health and earth monitoring call for improved imaging solutions in visible, LWIR and VLWIR offering advanced functionalities and cost effectiveness. Visible imagers market is currently largely dominated by non-European countries. LWIR µbolometers imagers, fabricated above-IC, have not yet been democratized for high volume markets due to the difficulty to solve performance versus cost equation. However, Asian providers are making important progress to tackle this challenge.ATHENA aims at strengthening European economy in high-tech imaging technologies:
- by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities
- by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions
- by using new methods of growing and doping materials for future VLWIR imager manufacturability.
This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring.
ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption.
In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.
Status
SIGNEDCall topic
HORIZON-KDT-JU-2023-2-RIA-Topic-1Update Date
24-12-2024
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Organisations
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| COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (CEA) (Coördinator)
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| ADMIR
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| CARL ZEISS AG
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| CATUAV SL
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| FOTONATION LIMITED (FotoNation Ltd)
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| FULLSCALE
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| IDEMIA IDENTITY & SECURITY FRANCE (IDEMIA)
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| INSTITUTO DE FISICA DE ALTAS ENERGIAS
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| ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA (ISD S.A.)
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| MAGNA ELECTRONICS ROMANIA S.R.L.
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| SENSIA SOLUTIONS SL
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| SILICON AUSTRIA LABS GMBH (SAL)
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| SOCIETE FRANCAISE DE DETECTEURS INFRAROUGES - SOFRADIR (SOFRADIR)
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| STMICROELECTRONICS CROLLES 2 SAS (STM CROLLES)
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| STMICROELECTRONICS GRENOBLE 2 SAS (STGNB 2 SAS)