Summary
The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors.
We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market.
The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.
The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition.
SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas:
i) Advanced features: prepare next generation of FDSOI technologies and components;
ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing;
iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar).
The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.
SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.
We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market.
The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.
The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition.
SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas:
i) Advanced features: prepare next generation of FDSOI technologies and components;
ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing;
iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar).
The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.
SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.
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More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/101139785 |
| Start date: | 01-06-2024 |
| End date: | 31-05-2027 |
| Total budget - Public funding: | 95 702 521,00 Euro - 24 126 877,00 Euro |
Cordis data
Original description
The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors.We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market.
The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.
The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition.
SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas:
i) Advanced features: prepare next generation of FDSOI technologies and components;
ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing;
iii) Digital, analog & RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar).
The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology.
SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.
Status
SIGNEDCall topic
HORIZON-KDT-JU-2023-1-IA-Topic-1Update Date
21-11-2024
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Organisations
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| STMICROELECTRONICS CROLLES 2 SAS (STM CROLLES) (Coördinator)
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| AED ENGINEERING GMBH (AED)
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| ANTENNEX BV
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| ARGUS SPACE AG
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| CITROBITS GMBH
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| COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (CEA)
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| DESIGN AND REUSE (D&R)
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| ECOLE CENTRALE DE LYON
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| EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH
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| Eindhoven University of Technology
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| FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
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| GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (GF)
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| GREENWAVES TECHNOLOGIES (GWT)
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| IC-LOGIC GMBH
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| IMST GMBH