HIPER | A revolutionary I/O Planning Solution for 2.5D & 3D Nanoelectronic Systems Design

Summary
HIPER is an advanced EDA (Electronic Design Automation) software for the optimization of I/O Planning of 2.5-D micro/nano electronic systems. This is an important enabling technology to assist in the design of 2.5D electronics and has been developed by MONOZUKURI S.p.A. HIPER is capable of analysing, designing and optimizing the 2.5-D I/O planning of all electronic components (ICs, silicon interposer and package(s)) thanks to its software platform and revolutionary algorithms. This innovative solution will leverage a 30% reduction in the production costs, a 50% decrease in design lead-time, and an improvement in the overall product performance due to 65% reduction in wire crossing and 80% reduction in total connections length.
The $7billion EDA market is dominated by three companies, Synopsys, Cadence Design Systems and Mentor Graphics. As a result of the work undertaken so far, in the 4th quarter of 2016 we started an official partnership with Synopsys where we have been granted access to their Physical implementation platform and we are currently working together to help two customers who are taping-out HBM-based 2.5D-IC.
The solution, which is already backed by many prospective clients, targets major semiconductors companies, design houses, package manufacturers, and OSAT businesses, and is expected to be used by leading electronic companies in Europe (Italy, Germany, UK), ASIA, and USA within three years after its commercialization. The Global Electronic Design Automation market is expected to grow at a CAGR of 8.52% over the period 2016-2020 which provides an encouraging base for introducing new EDA tools. Moreover, HIPER perfectly serves the “Electronics Strategy for Europe”, adopted in May 2013 by the European Commission.
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More information & hyperlinks
Web resources: https://cordis.europa.eu/project/id/822917
Start date: 01-08-2018
End date: 31-07-2020
Total budget - Public funding: 1 179 000,00 Euro - 825 300,00 Euro
Cordis data

Original description

HIPER is an advanced EDA (Electronic Design Automation) software for the optimization of I/O Planning of 2.5-D micro/nano electronic systems. This is an important enabling technology to assist in the design of 2.5D electronics and has been developed by MONOZUKURI S.p.A. HIPER is capable of analysing, designing and optimizing the 2.5-D I/O planning of all electronic components (ICs, silicon interposer and package(s)) thanks to its software platform and revolutionary algorithms. This innovative solution will leverage a 30% reduction in the production costs, a 50% decrease in design lead-time, and an improvement in the overall product performance due to 65% reduction in wire crossing and 80% reduction in total connections length.
The $7billion EDA market is dominated by three companies, Synopsys, Cadence Design Systems and Mentor Graphics. As a result of the work undertaken so far, in the 4th quarter of 2016 we started an official partnership with Synopsys where we have been granted access to their Physical implementation platform and we are currently working together to help two customers who are taping-out HBM-based 2.5D-IC.
The solution, which is already backed by many prospective clients, targets major semiconductors companies, design houses, package manufacturers, and OSAT businesses, and is expected to be used by leading electronic companies in Europe (Italy, Germany, UK), ASIA, and USA within three years after its commercialization. The Global Electronic Design Automation market is expected to grow at a CAGR of 8.52% over the period 2016-2020 which provides an encouraging base for introducing new EDA tools. Moreover, HIPER perfectly serves the “Electronics Strategy for Europe”, adopted in May 2013 by the European Commission.

Status

CLOSED

Call topic

EIC-SMEInst-2018-2020

Update Date

27-10-2022
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Horizon 2020
H2020-EU.2. INDUSTRIAL LEADERSHIP
H2020-EU.2.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
H2020-EU.2.1.0. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2
H2020-EU.2.3. INDUSTRIAL LEADERSHIP - Innovation In SMEs
H2020-EU.2.3.0. INDUSTRIAL LEADERSHIP - Innovation In SMEs - Cross-cutting calls
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2
H2020-EU.3. SOCIETAL CHALLENGES
H2020-EU.3.0. Cross-cutting call topics
H2020-EIC-SMEInst-2018-2020
H2020-SMEInst-2018-2020-2