Summary
The unstoppable race towards miniaturization is pushing the limits of electronics. This has to be conciliated with the inevitable Joule heating that affects all electronic devices, ultimately compromising miniaturization itself, as denser circuits require improved thermal management. Understanding and eventually controlling heat transport at the nanometer scale will lay the foundation for the design of present and future electronics, where the use of complex architectures and new nanomaterials, such as two-dimensional (2D) materials, holds a great potential. At such scales, atomic-scale defects, which are present everywhere in nature, play a fundamental role as just a single defect can greatly impact the properties of materials. However, our knowledge of the influence of an individual defect on heat propagation is surprisingly scarce. This is partly due to the limited spatial resolution of state-of-the-art thermal imaging.
HeaT2Defects aims to explore the fundamental properties of matter at a much smaller scale than is currently possible, engineering the influence of defects (namely vacancies, ripples and unconventional stacking) on heat transport of 2D devices. To this end, hinging on my extensive experience in scanning probe microscopy, I will develop an imaging technique with pioneering advances based on atomic force microscopy (AFM), Raman spectroscopy and nanoheater engineering. The versatility and resolution of AFM plus the thermal capabilities of Raman will allow thermal mapping with nm precision, improving state-of-the-art resolution by one order of magnitude. This will enable a deep understanding of the influence of defects on heat transport, and ultimately the engineering of the striking properties of 2D materials as thermal management components, vital to avoid energy waste and device malfunction. Far-reaching implications are expected, both from the profound impact of heat transport in many scenarios and from the technological developments.
HeaT2Defects aims to explore the fundamental properties of matter at a much smaller scale than is currently possible, engineering the influence of defects (namely vacancies, ripples and unconventional stacking) on heat transport of 2D devices. To this end, hinging on my extensive experience in scanning probe microscopy, I will develop an imaging technique with pioneering advances based on atomic force microscopy (AFM), Raman spectroscopy and nanoheater engineering. The versatility and resolution of AFM plus the thermal capabilities of Raman will allow thermal mapping with nm precision, improving state-of-the-art resolution by one order of magnitude. This will enable a deep understanding of the influence of defects on heat transport, and ultimately the engineering of the striking properties of 2D materials as thermal management components, vital to avoid energy waste and device malfunction. Far-reaching implications are expected, both from the profound impact of heat transport in many scenarios and from the technological developments.
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| Web resources: | https://cordis.europa.eu/project/id/101163902 |
| Start date: | 01-01-2025 |
| End date: | 31-12-2029 |
| Total budget - Public funding: | 1 500 000,00 Euro - 1 500 000,00 Euro |
Cordis data
Original description
The unstoppable race towards miniaturization is pushing the limits of electronics. This has to be conciliated with the inevitable Joule heating that affects all electronic devices, ultimately compromising miniaturization itself, as denser circuits require improved thermal management. Understanding and eventually controlling heat transport at the nanometer scale will lay the foundation for the design of present and future electronics, where the use of complex architectures and new nanomaterials, such as two-dimensional (2D) materials, holds a great potential. At such scales, atomic-scale defects, which are present everywhere in nature, play a fundamental role as just a single defect can greatly impact the properties of materials. However, our knowledge of the influence of an individual defect on heat propagation is surprisingly scarce. This is partly due to the limited spatial resolution of state-of-the-art thermal imaging.HeaT2Defects aims to explore the fundamental properties of matter at a much smaller scale than is currently possible, engineering the influence of defects (namely vacancies, ripples and unconventional stacking) on heat transport of 2D devices. To this end, hinging on my extensive experience in scanning probe microscopy, I will develop an imaging technique with pioneering advances based on atomic force microscopy (AFM), Raman spectroscopy and nanoheater engineering. The versatility and resolution of AFM plus the thermal capabilities of Raman will allow thermal mapping with nm precision, improving state-of-the-art resolution by one order of magnitude. This will enable a deep understanding of the influence of defects on heat transport, and ultimately the engineering of the striking properties of 2D materials as thermal management components, vital to avoid energy waste and device malfunction. Far-reaching implications are expected, both from the profound impact of heat transport in many scenarios and from the technological developments.
Status
SIGNEDCall topic
ERC-2024-STGUpdate Date
22-11-2024
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