Summary
In this ERC Proof-of-Concept project we will create a high-performance and scalable platform for spectrally resolved imaging in a highly compact on-chip device structure. This new concept for a hyperspectral imaging system will exploit three key outcomes of my ERC Starting Grant: (i) photoconductivity phenomena in semiconductor nanowires, (ii) high-throughput characterisation techniques for individual nanostructures and (iii) automated adaptive manufacturing processes for building functional nanostructure-based devices and systems. This hyperspectral imaging array will be a powerful demonstrator of the scalability and throughput of our adaptive manufacturing platform. It will unlock a new low-cost, portable, scalable and on-chip hyperspectral imaging technology that propels the diverse applications of hyperspectral imaging spanning point-of-care medical diagnostics, environmental monitoring, industrial process monitoring, materials inspection and beyond
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Web resources: | https://cordis.europa.eu/project/id/101188879 |
Start date: | 01-11-2024 |
End date: | 30-04-2026 |
Total budget - Public funding: | - 150 000,00 Euro |
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Original description
In this ERC Proof-of-Concept project we will create a high-performance and scalable platform for spectrally resolved imaging in a highly compact on-chip device structure. This new concept for a hyperspectral imaging system will exploit three key outcomes of my ERC Starting Grant: (i) photoconductivity phenomena in semiconductor nanowires, (ii) high-throughput characterisation techniques for individual nanostructures and (iii) automated adaptive manufacturing processes for building functional nanostructure-based devices and systems. This hyperspectral imaging array will be a powerful demonstrator of the scalability and throughput of our adaptive manufacturing platform. It will unlock a new low-cost, portable, scalable and on-chip hyperspectral imaging technology that propels the diverse applications of hyperspectral imaging spanning point-of-care medical diagnostics, environmental monitoring, industrial process monitoring, materials inspection and beyondStatus
SIGNEDCall topic
ERC-2024-POCUpdate Date
26-11-2024
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