Summary
NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.
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More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/830061 |
| Start date: | 01-11-2018 |
| End date: | 30-04-2021 |
| Total budget - Public funding: | 2 998 250,00 Euro - 2 098 775,00 Euro |
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Original description
NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.Status
CLOSEDCall topic
EIC-SMEInst-2018-2020Update Date
26-10-2022
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