EPI SGA1 | SGA1 (Specific Grant Agreement 1) OF THE EUROPEAN PROCESSOR INITIATIVE (EPI)

Summary
The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. EPI SGA1 will:
- Develop the roadmap for the full length of the EPI initiative
- Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards)
- Tape-out of the first generation chip by integrating the IPs developed
- Validate this chip in the HPC context and in the automotive context using a demonstration platform
The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.
Unfold all
/
Fold all
More information & hyperlinks
Web resources: https://cordis.europa.eu/project/id/826647
Start date: 01-12-2018
End date: 31-12-2021
Total budget - Public funding: 79 991 745,00 Euro - 79 991 745,00 Euro
Cordis data

Original description

The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. EPI SGA1 will:
- Develop the roadmap for the full length of the EPI initiative
- Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards)
- Tape-out of the first generation chip by integrating the IPs developed
- Validate this chip in the HPC context and in the automotive context using a demonstration platform
The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.

Status

CLOSED

Call topic

SGA-LPMT-01-2018

Update Date

27-10-2022
Images
No images available.
Geographical location(s)
Structured mapping
Unfold all
/
Fold all
Horizon 2020
H2020-EU.2. INDUSTRIAL LEADERSHIP
H2020-EU.2.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
H2020-EU.2.1.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)
H2020-EU.2.1.1.2. Next generation computing: Advanced and secure computing systems and technologies, including cloud computing
H2020-SGA-LPMT-2018
SGA-LPMT-01-2018 Specific Grant Agreement European Low-Power Microprocessor Technologies 2018