Summary
The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. EPI SGA1 will:
- Develop the roadmap for the full length of the EPI initiative
- Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards)
- Tape-out of the first generation chip by integrating the IPs developed
- Validate this chip in the HPC context and in the automotive context using a demonstration platform
The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.
- Develop the roadmap for the full length of the EPI initiative
- Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards)
- Tape-out of the first generation chip by integrating the IPs developed
- Validate this chip in the HPC context and in the automotive context using a demonstration platform
The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.
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More information & hyperlinks
Web resources: | https://cordis.europa.eu/project/id/826647 |
Start date: | 01-12-2018 |
End date: | 31-12-2021 |
Total budget - Public funding: | 79 991 745,00 Euro - 79 991 745,00 Euro |
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Original description
The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications. EPI SGA1 will:- Develop the roadmap for the full length of the EPI initiative
- Develop the first generation of technologies through a co-design approach (IPs for general-purpose HPC processors, for accelerators, for trusted chips, software stacks and boards)
- Tape-out of the first generation chip by integrating the IPs developed
- Validate this chip in the HPC context and in the automotive context using a demonstration platform
The project will deliver a high performance, low power processor, implementing vector instructions and specific accelerators with high bandwidth memory access. The EPI processor will also meet high security and safety requirements. This will be achieved through intensive use of simulation, development of a complete software stack and tape-out in the most advanced semiconductor process node. SGA1 will provide a competitive chip that can effectively address the requirements of the HPC, AI, automotive and trusted IT infrastructure markets.
Status
CLOSEDCall topic
SGA-LPMT-01-2018Update Date
27-10-2022
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H2020-EU.2.1.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)