FAB2ASM Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly

Summary

3D integration is a rapidly emerging technology which vertically stacks and interconnects multiple materials, technologies, and components to form micro- and nanosystems for applications such as implantable medical devices, intelligent sensors and the radio frequency devices found in mobile phones. 3D integration is a very promising area of technological development and shows huge economic potential. This state-of-the-art technology relies on robotic pick-and-place machines and machine vision, which cannot be both fast and accurate at the same time. If high precision, e.g. a micrometer is needed, the cycle times for integration can be very considerable. The FAB2ASM project will overcome these limits by marrying traditional robotic tools with the physics of self-alignment, where tiny chips will align owing to the surface tension of the liquid or other physical forces. FAB2ASM will develop a technology which not only reuses most of the industrial process steps but also improves the performance of the integration process in terms of precision and efficiency. It will allow the handling of small (100 µm) and/or thin dies (20 µm) and ultra high-speed assembly. It will improve the competitiveness of European nano- and ?-manufacturing by going beyond state-of-the-art integration technology. The partners in the consortium represent a major share of European industry in nano- and micro manufacturing. With the results of FAB2ASM, the project is expected to improve the market share in microsystem devices by up to 5%. In contrast to many other new technologies, which use a totally different process than that of the current industrial base, FAB2ASM technologies are able to preserve the current investment from industry and re-exploit a great deal of technological know-how. FAB2ASM will provide technology which enables innovative products to be produced competitively, while counterbalancing the trend of outsourcing production to low-wage economies.

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Web resources:	http://www.fab2asm.eu https://cordis.europa.eu/project/id/260079
Start date:	01-05-2010
End date:	30-04-2013
Total budget - Public funding:	7 053 328,00 Euro - 4 733 600,00 Euro

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Original description

FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as well as the density of the connections. The state-of-the-art integration technology for 3D microsystems relies on robotic pick-and-placing machines and machine vision, which cannot achieve simultaneously high-speed and high-precision. If high precision e.g. a micron is needed, either the cycle time of integration can be very long, from e.g. over ten seconds to minutes, or even not achievable. The objective of the FAB2ASM is to develop highly efficient and precise die-level component integration technology based on hybrid assembly technology that joins robotic tools and self-alignment and corresponding interfacing methods for multi-functional microsystems. In contrast to most explorative self-assembly technology developed to-date, FAB2ASM attempts to develop a highly industry relevant technology that reuses most of the industrial process steps, but on the other hand dramatically improves the performance of the integration process in the precision and efficiency chart. FAB2ASM will allow handling small (100 µm) and/or thin dies (20 µm), ultra high speed assembly (40,000 UPH), and flip-chip capabilities, while ensuring industry proven reliability. Led by AALTO, this consortium of 5 research centers and 4 industries (ST, NXP, BX, 3DPLUS) will join force to fulfil this urgent and important need of industry in 3D integration, and will demonstrate the merits in three industry led demonstrators: one manufacturing equipment demonstrator, one photonic IC demonstrator and 3D microelectronics demonstrator.