Virtual Metrology to Eliminate Test Wafers Measurements on Copper Electroplating Deposition

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Authors: A. Doinychko, U. Amato, S. Raitsyn, S. Perna, F. Blundo, C. Genua, D. Vinciguerra, A. La Magna, A. Torres, A. Rosenbaum, M.-R. Amini, and P. Vasquez

Journal title: 2021 IEEE 17th International Conference on Automation Science and Engineering

Journal publisher: IEEE

Published year: 2021