PCM/wood composite to store thermal energy in passive building envelopes

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Authors: C Barreneche, J Vecstaudza, D Bajare, A.I. Fernandez

Journal title: IOP Conference Series: Materials Science and Engineering

Journal number: 251

Journal publisher: IOP Publishing

Published year: 2017

Published pages: 012111

DOI identifier: 10.1088/1757-899X/251/1/012111

ISSN: 1757-8981