Reliable Copper Plating Process for Bifiacial Heterojunction Cells

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Authors: Agata Lachowicz, Jonas Geissbühler, Antonin Faes, Jonathan Champliaud, Joost Hermans, Jean-Francois Lerat, Pierre-Jean Ribeyron, Charles Roux, Guillaume Wahli, Pierre Pape, Benjamin Strahm, Jörg Horzel, Christophe Ballif and Matthieu Despeisse

Journal title: Metallization Workshop

Journal number: Mon, S4

Journal publisher: N/C

Published year: 2017