Processing Routes and Costs for Copper Plating on Bifacial Heterojunction Cells

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Authors: A. Lachowicz, J. Geissbühler, A. Faes, J. Champliaud, J. Horzel, C. Ballif, M. Despeisse, M. Sciuto, A. Battaglia, J.-F. Lerat, D. Muñoz, P.-J. Ribeyron, P. Papet, B. Strahm

Journal title: EU PVSEC 2018

Journal number: 2CO.12.5

Journal publisher: WIP GmbH & Co Planungs-KG

Published year: 2018