Summary
This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.
Authors: F. Predan, S. Heckelmann, M. Niemeyer, D. Lackner, A. Kovacs, R.E. Dunin-Borkowski, W. Jager, F. Dimroth
Journal title: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Journal publisher: IEEE
Published year: 2017
Published pages: 37-37
DOI identifier: 10.23919/LTB-3D.2017.7947433
ISBN: 978-4-904743-03-4