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Authors: Martin Benedikt, Stefan Thonhofer
Journal title: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2016
Published pages: 1-4
DOI identifier: 10.1109/EuroSimE.2016.7463345
ISBN: 978-1-5090-2106-2
