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Authors: Izsak Ferencz, Dorin Petreus, Pietro Tricoli
Journal title: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Journal publisher: IEEE
Published year: 2020
Published pages: 362-367
DOI identifier: 10.1109/siitme50350.2020.9292214
ISBN: 978-1-7281-7506-5