Electromechanical impedance method for assessment of adhesive bonds of CFRP at the production and repair stage

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Authors: P. Malinowski, T. Wandowski, W. Ostachowicz

Journal title: Proceedings of the 8th International Symposium on NDT in Aerospace

Journal number: November 3-5, 2016

Journal publisher: AeroNDT 2016

Published year: 2016

DOI identifier: 10.5281/zenodo.1245632