Influence of repair-related modification of adhesive bonds on electromechanical impedance characteristics

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Authors: Paweł Henryk Malinowski; Wiesław Mieczysław Ostachowicz; Kai Brune

Journal title: Proceedings of the 6th EASN International Conference in Innovation in European Aeronautics Research

Journal number: October 2016

Journal publisher: EASN Association

Published year: 2016

Published pages: 516-520

DOI identifier: 10.5281/zenodo.1245643