Study of Adhesive Bonds by Mechanical Tests, Ultrasounds and Electromechanical Impedance Method

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Authors: PAWEŁ H. MALINOWSKI, KONSTANTINOS I. TSERPES, ROMAIN ECAULT, WIESŁAW M. OSTACHOWICZ

Journal title: Structural Health Monitoring 2017

Journal publisher: DEStech Publications, Inc.

Published year: 2017

DOI identifier: 10.12783/shm2017/13903

ISBN: 978-1-60595-330-4