Recovery of PC/ABS from WEEE plastic shred by the CreaSolv ® process

Summary

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Authors: Martin Schlummer, Fabian Wolff, Andreas Maurer

Journal title: 2016 Electronics Goes Green 2016+ (EGG)

Journal publisher: IEEE

Published year: 2016

Published pages: 1-6

DOI identifier: 10.1109/EGG.2016.7829841