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Authors: George Suciu, Ana Lavinia Petrache, Cristina Badea, Tony Buteau, David Schlachet, Loic Durand, Matthieu Landez, Ijaz Hussain
Journal title: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME)
Journal publisher: IEEE
Published year: 2018
Published pages: 234-238
DOI identifier: 10.1109/siitme.2018.8599228
ISBN: 978-1-5386-5577-1