Memory Array Demonstration of fully integrated 1T-1C FeFET concept with separated ferroelectric MFM device in interconnect layer

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Authors: Konrad Seidel; David Lehninger; Raik Hoffmann; Tarek Ali; Maximilian Lederer; Ricardo Revello; Konstantin Mertens; Kati Biedermann; Yukai Shen Defu Wang,Matthias Landwehr, Andreas Heinig, Thomas Kämpfe, Hannes Mähne, Kerstin Bernert, Steffen Thiem,

Journal title: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/vlsitechnologyandcir46769.2022.9830141