Increase of wafer inspection tool throughput with computational imaging

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Oleg Soloviev, Hieu Thao Nguyen, Jacques Noom, and Michel Verhaegen

Journal title: Proc. SPIE 12098, Dimensional Optical Metrology and Inspection for Practical Applications XI

Journal number: 120980G (31 May 2022)

Journal publisher: SPIE

Published year: 2022

DOI identifier: 10.1117/12.2618736