Wafer-level vacuum sealing for packaging of silicon photonic MEMS

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Authors: G. Jo, P. Edinger, S. Bleiker, X. Wang, A.Y. Takabayashi, H. Sattari, N. Quack, P. Verheyen, G. Stemme, W. Bogaerts, K. B. Gylfason, and F. Niklaus

Journal title: SPIE Photonics West - OPTO

Journal publisher: SPIE

Published year: 2021

Published pages: 11691-11

DOI identifier: 10.1117/12.2582975

ISBN: 978-1-5106-4230-0