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Authors: R. Hersent, A. Konczykowska, F. Jorge, F. Blache, V. Nodjiadjim, M. Riet, C. Mismer and J. Renaudier
Journal title: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Journal number: 15311309
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2021
Published pages: 752-755
DOI identifier: 10.1109/lmwc.2022.3161706
ISSN: 1531-1309