Improving the Consistency of the Failure Mode Effect Analysis (FMEA) Documents in Semiconductor Manufacturing

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Houssam Razouk, Roman Kern

Journal title: Applied Sciences

Journal number: 20763417

Journal publisher: MDPI

Published year: 2022

DOI identifier: 10.3390/app12041840

ISSN: 2076-3417