Wafer-level hermetically sealed silicon photonic MEMS by Direct Metal-to_Metal Bonding

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Arun Kumar Malik, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, and Frank Niklaus

Journal publisher: WaferBond’22 Conference

Published year: 2022