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Authors: J. Hegedüs, G. Hantos, M. Lukács, B. Bodnár, G. Lipák and A. Poppe
Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal number: May 19th, 2023
Journal publisher: Institute of Electrical and Electronics Engineers Inc.
Published year: 2023
DOI identifier: 10.1109/tcpmt.2023.3278101
ISSN: 2156-3950
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