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Authors: J. Magnien, L. Mitterhuber, K. Fladischer, J. Rosc, E. Kraker
Journal title: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2023)
Journal number: 16-19 April 2023
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/eurosime56861.2023.10100790
ISBN: 979-8-3503-4597-1