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Authors: N. Travellin, N. Roccato, R. Fraccaroli, F. Piva, M. Buffolo, C. Santi, C. Narduzzi, A. Caria, G. Meneghesso, E. Zanoni, M. Meneghini
Journal title: 29th INTERNATIONAL WORKSHOP Thermal Investigations of ICs and Systems-Therminic 2023
Journal number: 27-29 September 2023
Journal publisher: IEEE
Published year: 2023