Characterization and optimization of the heat dissipation capability of a chip-on-board package using finite element methods

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Authors: Z. Cao, M. Stocchi, M. Wietstruck, T. Mausolf, C. Carta and M. Kaynak

Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal publisher: IEEE

Published year: 2023

DOI identifier: 10.1109/tcpmt.2023.3259199

ISSN: 2156-3985