An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package

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Authors: Z. Cao, B. Heusdens, A. Ziaei and M. Kaynak

Journal title: 17th European Microwave Integrated Circuits Conference (EuMIC)

Journal publisher: IEEE

Published year: 2022

Published pages: 4

DOI identifier: 10.23919/eumic54520.2022.9923481