An advanced finite element model of the Cu pillar solder reflow assembly

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Authors: Z. Cao, B. Pekkolay, A. Okur, B. Heusdens, C. Carta, M. Kaynak

Journal title: 24th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal publisher: IEEE

Published year: 2023

DOI identifier: 10.1109/eurosime56861.2023.10100808