Further development of the Disassembly Map, a method to guide product design for disassembly

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Authors: De Fazio, F., Bolanos Arriola, J., Dangal, S., Flipsen, B., & Balkenende, R.

Journal title: Electronics Goes Green 2020+

Journal publisher: Fraunhofer Institut für Zuverlässigkeit und Mikrointegration

Published year: 2020

ISBN: 978-3-8396-1659-8