Condition monitoring indicators for Si and SiC power modules

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Authors: Di Nuzzo, G., Tuellmann, M., Methfessel, T., & Rzepka, S.

Journal title: Microelectronics Reliability

Journal number: 138

Journal publisher: Elsevier BV

Published year: 2022

Published pages: 114614

DOI identifier: 10.1016/j.microrel.2022.114614

ISSN: 0026-2714