Electrochemical deposition of Indium bumps on Superconducting interconnect and thermo-compression bonding for cryogenic and quantum computing

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Authors: Kumin Kang, Jaber Derakhshandeh, Christian Wendeln, Ralf Schmidt, Hao-Yu , Ehsan Shafahian, Zaid El-Mekki, Tom Cochet, Masataka Maehara and Eric Beyne

Journal publisher: IEEE ECTC

Published year: 2023