Patterned InterVia for Heterogeneous Integration of III-V devices onto silicon photonics by using micro-Transfer Printing

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Authors: Ali Uzun, Johanna Rimböck, Jacek Gasiorowski, , Alex Farrell, Alin Fecioru, Ruggero Loi and Brian Corbett

Journal title: 3DIC conference 2023, Cork

Journal number: 11/05/2023

Journal publisher: IEEE

Published year: 2023