Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

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Authors: Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F

Journal title: WaferBond’22 Conference

Journal publisher: WaferBond’22 Conference

Published year: 2022