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Authors: Lisa Mitterhuber, Verena Leitgeb, Markus Krainz, Robert Strauss, Thomas Kaden, Eldad Bahat Treidel, Frank Brunner, Christian Huber, Elke Kraker
Journal title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal number: Yearly
Journal publisher: IEEE
Published year: 2023
Published pages: pp 1-8
DOI identifier: 10.1109/eurosime56861.2023.10100765
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