Large-Area Soft e-Skin: The Challenges Beyond Sensor Designs

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Authors: Ravinder Dahiya, Nivasan Yogeswaran, Fengyuan Liu, Libu Manjakkal, Etienne Burdet, Vincent Hayward, Henrik Jorntell

Journal title: Proceedings of the IEEE

Journal number: 107/10

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2019

Published pages: 2016-2033

DOI identifier: 10.1109/JPROC.2019.2941366

ISSN: 0018-9219