PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping

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Authors: Yogeenth Kumaresan, Sihang Ma, Ravinder Dahiya

Journal title: Microelectronic Engineering

Journal number: 247

Journal publisher: Elsevier BV

Published year: 2021

Published pages: 111588

DOI identifier: 10.1016/j.mee.2021.111588

ISSN: 0167-9317