Ultra-Thin Chips with Printed Interconnects on Flexible Foils

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Sihang Ma, Yogeenth Kumaresan, Abhishek Singh Dahiya, Ravinder Dahiya

Journal title: Advanced Electronic Materials

Journal number: 2199160x

Journal publisher: Wiley-VCH GmbH

Published year: 2021

DOI identifier: 10.1002/aelm.202101029

ISSN: 2199-160x