Technologies for Realisation of Ultra-thin Chips

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Authors: Yogeenth Kumaresan, Nivasan Yogeswaran, Ravinder Dahiya

Journal title: 2020 IEEE Latin America Electron Devices Conference (LAEDC)

Journal publisher: IEEE

Published year: 2020

Published pages: 1-4

DOI identifier: 10.1109/laedc49063.2020.9073550

ISBN: 978-1-7281-1044-8