Hierarchical Bonding Yield Test Structure for Flexible High Channel-Count Neural Probes Interfacing ASIC Chips

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: M. C. Odenthal, V. Claar, O. Paul, and P. Ruther

Journal title: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)

Journal number: Annually

Journal publisher: IEEE

Published year: 2023

DOI identifier: 10.1109/mems49605.2023.10052500