Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems

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Authors: Franz Selbmann; Mario Baum; Christoph Meinecke; Maik Wiemer; Harald Kuhn; Yvonne Joseph

Journal title: ECS Journal of Solid State Science and Technology

Journal number: 10

Journal publisher: IOP Publishing Limited

Published year: 2021

Published pages: 074010

DOI identifier: 10.1149/2162-8777/ac12b6

ISSN: 2162-8777